ISyE Colloquium:Physics Based and Data-Driven Pattern Analysis for Improved Manufacturing Equipment and Process Modeling
Presented by: Peng Wang
Monday, February 4, 2019
Driven by the continued advancement in sensor miniaturization, high-performance computing, and cyberinfrastructure, new opportunities have emerged for collecting, processing, and managing large volumes of data from the factory floor that provide insight into the state of manufacturing equipment and processes. Effective learning from the data to improve operational safety, energy efficiency, and sustainability, however, has remained a challenge.